Answer
Beryllium Copper (Alloy 25 / UNS C17200) is selected primarily for its high electrical conductivity and non-magnetic properties. In electronic housings, it serves as both a retaining ring and an EMI/RFI shield. After age hardening at $315^\circ C$, it achieves a tensile strength of up to $1300$ MPa, comparable to carbon steel. Additionally, its high thermal conductivity helps dissipate heat from the assembly. However, engineers must account for its lower modulus ($E \approx 125$ GPa), which results in a lower seating force compared to steel rings of the same dimensions.